Smart Materials Design for Electromagnetic Interference Shielding Applications

Lightweight Carbon Composite Foams for Electromagnetic Interference Shielding Applications

Author(s): Rajeev Kumar*, Tejendra K. Gupta, Neeraj Dwivedi and D.P. Mondal

Pp: 59-108 (50)

Doi: 10.2174/9789815036428122010005

* (Excluding Mailing and Handling)


In the modern technological era, various electronic devices are being widely used in proportion to the fast-growing demand in society. These devices have created electronic pollutions such as electronic noise, electromagnetic interference (EMI), and radiofrequency interference (RFI), leading to improper functioning of electronic devices. In view of mitigating these detrimental effects, strong EMI shielding materials are required. In recent years, carbon composite foams have attracted worldwide interest due to their outstanding properties such as lightweight, interconnected porosity, high surface area, excellent corrosion resistance, superior electrical and thermal properties that are highly useful for suppressing electromagnetic noises. In this chapter, several carbon foam preparation methods, such as the foaming method, pressure release method, template method, etc., are described. The effect of precursors like pitches, resins, polymers, and biodegradable materials on the microstructure, electrical, and EMI shielding properties of carbon composite foams have been studied. The influences of different fillers such as CNT, graphene, MXene, metals, and magnetic materials on the electrical conductivity and EMI shielding properties of carbon composite foams have been deeply reviewed. The EMI shielding, density, and thickness of carbon composite foam with various loading of fillers are summarized in tables in this chapter, which will provide readers with useful information. In the last section, current challenges and future research directions of this growing field are also discussed. 

Keywords: Carbon composite foam, CNTs, Electrical conductivity, EMI shielding, Graphene, Magnetic fillers, Metals, MXene, Pitch, Polymer.

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