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Author(s): Hirokazu Tohya
Pp: 109-119 (11)
DOI: 10.2174/9781608054497113010012
* (Excluding Mailing and Handling)
The best decoupling component was the solid aluminum LILC. The prototyping result for solving the problems which was clarified at the feasibility study is presented.
Keywords: Solid Aluminum LILC, slender chip formation, chip length, aluminum film, alumina, universal test fixture, S parameter, test jig, transmission coefficient, electromagnetic coupling, roll-roll manufacturing chip length, attenuation constant, terminal impedance, FDTD simulator, transmission characteristics, poly pyrrole (Ppy), PEDOT, TCNQ, current capability.
Cite this chapter as:
Improvement of Solid Aluminum LILC [1, 2], Switching Mode Circuit Analysis and Design: Innovative Methodology by Novel Solitary Electromagnetic Wave Theory (2013) 1: 109. https://doi.org/10.2174/9781608054497113010012
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